A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototype (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography.

A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.

1. A method of rapid prototyping a part, the method comprising: fabricating a first part layer in a stereolithography apparatus; registering the first part layer on adirect-write apparatus; depositing a first trace of direct-write compatible media onto the first part layer; curing the first trace of direct-write compatible media deposited on the first part layer; registering the first part layer on thestereolithography apparatus; and fabricating a second part layer on top of the first part layer.

2. The method of claim 1 further comprising curing the first part layer, prior to depositing the direct-write compatible media.

3. The method of claim 1 further comprising creating an electrical interconnect.

4. The method of claim 1 further comprising building three-dimensional (3D) circuits.

5. The method of claim 1, wherein fabricating a second part layer includes encapsulating the direct-write compatible media.

6. The method of claim 1 further comprising: registering the second part layer on the dire